I-MLPF-WB55-02E3 I-Signal Conditioning 2.4 GHz I-chip ehambisanayo yesihlungi ye-STM32WB55Vx
♠ Incazelo Yomkhiqizo
| Isibaluli Somkhiqizo | Isibaluli senani |
| Umkhiqizi: | I-STMicroelectronics |
| Isigaba somkhiqizo: | Isimo Sesignali |
| I-RoHS: | Imininingwane |
| Uhlobo Lomkhiqizo: | Isimo Sesignali |
| Ukupakishwa: | I-reel |
| Ukupakishwa: | Sika Tape |
| Ukupakishwa: | I-MouseReel |
| Ibhrendi: | I-STMicroelectronics |
| Inani Lephakethe Lefekthri: | 5000 |
| Isigaba esingaphansi: | Izihlungi |
| Isisindo Seyunithi: | 0.000055 oz |
♠ 2.4 GHz isihlungi sokudlula okuphansi sifaniswa ne-STM32WB55Vx
I-MLPF-WB55-02E3 ihlanganisa inethiwekhi yokuqhathanisa ne-impedance nesihlungi se-harmonics. Inethiwekhi ye-impedance efanayo iklanyelwe ukukhulisa ukusebenza kwe-RF kwe-STM32WB55Vx. Le divayisi isebenzisa ubuchwepheshe be-STMicroelectronics IPD ku-non-conductive glass substrate ethuthukisa ukusebenza kwe-RF.
• I-impedance ehlanganisiwe yokufanisa ku-STM32WB55Vx
• I-LGA footprint iyahambisana
• 50 Ω ukuphazamiseka kwegama ohlangothini lwezimpondo
• Isihlungi se-harmonics yokwenqaba okujulile
• Ukulahlekelwa kokufaka okuphansi
• Izinyathelo ezincane
• Ugqinsi oluphansi ≤ 450 μm
• Ukusebenza okuphezulu kwe-RF
• I-RF BOM kanye nokunciphisa indawo
• Ingxenye ethobelayo ye-ECOPACK2
• I-Bluetooth 5
• I-OpenThread
• I-Zigbee®
• IEEE 802.15.4
• Kwenzelwe i-STM32WB55Vx
