I-SAMSUNG ihlela ukuphinda kathathu umthamo wokutholwa kwe-chip ngo-2027

UJeong Ki-tae, iphini likamongameli wezokuthuthukiswa kobuchwepheshe ophikweni lwebhizinisi elisungulwe yinkampani, uthe abakwaSamsung Electronics bakhiqize ngempumelelo ngobuningi i-chip engu-3-nanometer esekelwe kubuchwepheshe be-GAA okokuqala ngqa emhlabeni kulo nyaka, esebenzisa amandla aphansi ngamaphesenti angu-45, ukusebenza okuphezulu ngamaphesenti angu-23 kanye nendawo engaphansi ngamaphesenti angu-16 uma kuqhathaniswa ne-chip ye-5-nanometer.

I-Samsung Electronics futhi ihlela ukugodla umzamo wokwandisa umthamo wokukhiqiza we-chip foundry yayo, okuhloswe ngayo ukuba namandla angaphezu kokuphindwe kathathu kokukhiqizwa kwayo ngo-2027. Ukuze kufezeke lokho, umenzi we-chip uphishekela isu elithi "igobolondo lokuqala", elihilela ukwakha igumbi elihlanzekile kuqala bese esebenzisa lesi sikhungo ngokuguquguquka njengoba kuphakama isidingo semakethe.

UChoi Si-young, umongameli weSamsung Electronics ophikweni lwezamabhizinisi, uthe, "Sisebenza izimboni ezinhlanu eKorea nase-United States, futhi sithole iziza zokwakha izimboni ezingaphezu kwe-10."

I-IT House ifunde ukuthi i-Samsung Electronics ihlela ukwethula inqubo yesizukulwane sesibili se-3-nanometer ngo-2023, iqale ukukhiqizwa ngobuningi be-2-nanometer ngo-2025, futhi yethule inqubo ye-nanometer engu-1.4 ngo-2027, umgwaqo wobuchwepheshe owavezwa u-Samsung okokuqala e-San Francisco ngo-Oct. 3 (isikhathi sendawo).